3240 epoxy board application characteristics
1.low shrinkage. The reaction of the 3240 epoxy board and the curing agent used is carried out by direct addition reaction or ring-opening polymerization of the epoxy groups in the resin molecules, without the release of water or other volatile by-products. Compared with unsaturated polyester resins and phenolic resins, they show very low shrinkage (less than 2%) during curing.
2. mechanical properties. The cured 3240 epoxy board has excellent mechanical properties.
3. various forms. A variety of resins, curing agents, and modifier systems can be adapted to suit the requirements of various applications, ranging from very low viscosity to high melting point solids.
4. easy to cure. With a variety of different curing agents, the 3240 epoxy board can be cured in temperatures ranging from 0 to 180°C.
5. strong adhesion. The existence of polar hydroxyl groups and ether bonds inherent in the molecular chain of the 3240 epoxy plate makes it highly adhesive to various substances. The shrinkage of the epoxy resin when cured is low and the resulting internal stress is small, which also helps to increase the adhesive strength.