FR-4 copper clad laminated sheet,use glass fiber cloth as substrate material, immersed with epoxy resin, bake into prepreg sheet, combined several prepreg sheets single side or double sides with copper foil, hot pressing, curing, then forming CCL.

FR-4Copper clad laminated sheet has excellent thermal stability and machinability, widely used in the manufacture of printed circuit board (PCB) for television sets, computers, communications equipment and other electronic products.

NO.

Item

Unit

Value

Typical value

1

Copper foil peel strength

125℃

N/mm

≥0.7

1.5

float288℃/10sec

≥1.05

1.65

2

Thermal Stress (float288℃/unetched)

sec

≥10

120

3

Warpage (without treatment)

≤1.0

0.20

4

flammability ( UL94)

V-0

V-0

5

Vitrification transition temperature

≥130

138

6

Surface resistivity (35℃ air)

≥1.0*104

1.0*106

7

Volume resistivity(35℃ air)

MΩ/cm

≥1.0*106

1.0*108

8

Dielectric constant(1MHz)

≤5.5

5.0

9

Dielectric loss factor (1MHz)

≤0.035

0.024

10

Arc resistance

sec

≥60

120

11

Moisture absorption

%

≤0.8

0.3

12

Comparative tracking index

V

≥150

170

13

Dimensional stability

warp

ppm

±300

-200

fill

-180