Aluminum substrates and fr4 copper clad laminates are two common copper clad laminates, but many people do not know them. Today we mainly introduce the basic structure of these two kinds of plates.
Comparing the main characteristics of the aluminum substrate and the FR-4 board: the heat dissipation of the aluminum substrate and the FR-4 board is compared with the heat resistance of the substrate: the substrate is an aluminum substrate, and the FR-4 board is a transistor PCB, and the heat dissipation of the substrate is different, The test data that causes the operating temperature to rise is different.
Performance: Conductor (copper wire) and fuse current on different substrate materials. From the comparison of the aluminum substrate and the FR-4 board, since the metal substrate has a high heat dissipation amount, the wire is remarkably improved, and the high heat dissipation characteristics of the aluminum substrate are explained from another angle. The heat dissipation of the aluminum substrate is related to the thickness and thermal conductivity of the insulating layer. The thinner the insulating layer, the higher the thermal conductivity of the aluminum substrate (but the lower the pressure resistance).

aluminum substrate and FR4 copper clad laminate
Machinability:
The aluminum substrate has higher mechanical strength and toughness than the FR-4 board. For this purpose, a large-area printed board can be fabricated on an aluminum substrate on which large components can be mounted.
Electromagnetic shielding:
In order to ensure the performance of the circuit, certain components in the electronic product need to prevent electromagnetic wave radiation and interference. The aluminum substrate can be used as a shield to shield electromagnetic waves.
Thermal expansion coefficient:
The quality of the metallized holes and wires is affected by the thermal expansion of the general FR-4, especially the thermal expansion of the plate thickness. The main reason is that the thermal expansion coefficient of copper in the raw material has a thermal expansion coefficient of 17 * 106cm / cm-C, and the FR-4 plate has a thickness of 110 * 106cm / cm-C. The difference is large, and the substrate expansion and copper wire change are easy to occur. Metal hole rupture has a detrimental effect on product reliability. The thermal expansion coefficient of the aluminum substrate is 50×106 cm / cm-C, which is smaller than that of the ordinary FR-4 plate and is close to the thermal expansion coefficient of the copper foil. This helps to ensure the quality and reliability of the printed circuit board.
The application circuit is different and the application fields are different. The FR-4 board is suitable for general circuit design and general electronic products.

ZTELEC offers aluminum substrates, FR4 copper clad laminates, and cem-3 copper clad laminates.