Polyimide Film Adhesive Tape is produced from polyimide film coated with heat resistant adhesive.It is an ideal insulating product for H class use.
Characters: Excellent heat resistance: can work for a long time at 180℃ and endure heat shock of 160℃.
Better tear resistance: it can work on the surface with different shapes and sizes.
Higher mechanical strength, better dielectric strength and good bonding strength.
Application: It is widely used in ground insulation, phase insulation, layer insulation, barrier insulation and core wrap for electrical motors and transformers; also used in PCB wave soldering, hot air leveling and other bonding applications under high temperature and corrosion conditions.