the difference between aluminum substrate and FR4 copper clad laminate
Aluminum substrates and fr4 copper clad laminates are two common copper clad laminates, but many people do not know them. Today we mainly introduce the basic structure of these two kinds of plates.
Comparing the main characteristics of the aluminum substrate and the FR-4 board: the heat dissipation of the aluminum substrate and the FR-4 board is compared with the heat resistance of the substrate: the substrate is an aluminum substrate, and the FR-4 board is a transistor PCB, and the heat dissipation of the substrate is different, The test data that causes the operating temperature to rise is different.
Performance: Conductor (copper wire) and fuse current on different substrate materials. From the comparison of the aluminum substrate and the FR-4 board, since the metal substrate has a high heat dissipation amount, the wire is remarkably improved, and the high heat dissipation characteristics of the aluminum substrate are explained from another angle. The heat dissipation of the aluminum substrate is related to the thickness and thermal conductivity of the insulating layer. The thinner the insulating layer, the higher the thermal conductivity of the aluminum substrate (but the lower the pressure resistance).
