The copper-clad high-frequency electronic substrate products (hereinafter referred to as “5G high-frequency copper-clad boards“) for the 5G communication equipment developed and produced by ZTELEC GROUP have been successfully tested by the third-party testing institutions designated by the Ministry of Industry and Information Technology, marking ZTELEC’s first high at 5G. The development of frequency-covered copper plates has been successful.
5G high frequency copper clad laminate is an essential foundation material for the 5G era
The 5G high-frequency substrate is the latest insulation material product that has appeared in recent years. If you compare various electronic products to high-rise buildings, the 5G substrate is just like reinforced concrete. Whether it is artificial intelligence, communication products or driverless, the basic hardware must use the substrate, which is the indispensable main component of most electronic products to achieve circuit interconnection. The communication equipment manufactured by 5G high-frequency substrate products has a low dielectric loss coefficient under high-frequency electronic communication signals, and is the future 5G mobile phone, communication equipment and base station, aerospace, high-end military equipment, high-end electronic equipment and other industries. Essential foundation material.
The precision requirements for the production control of 5G high-frequency CCL developed by ZTELEC for 3 years are one order of magnitude higher than that of ordinary electronic laminates. It is a high-end electronic insulation material with high standard, high quality, high performance and high reliability. The products are mainly used for production. 5G high-frequency high-speed mobile phone and communication equipment, specifically used to manufacture high-frequency precision electronic circuit board substrates, can adapt to different types of circuit boards such as single-sided circuit boards, double-sided circuit boards and multi-layer circuit boards.
The 5G high-frequency substrate developed by ZTELEC solves the industrial problem of medium-high temperature dielectric conduction stability, and can meet the strict quality control requirements of 5G mobile phone manufacturing users. It can be applied not only to the manufacture of 5G high-performance consumer electronic products, such as 5G mobile phones, 5G communication equipment and base stations, but also to the use of aerospace, high-end military equipment, high-end electronic equipment and other manufacturing industries, similar products in the industry, The quality is even better.