The Aluminum base CCL has a circuit layer, an insulating layer, and an insulating metal substrate.
The circuit layer (usually using electrolytic copper foil) is etched to form a printed circuit for assembly and connection of the device. Compared to conventional FR-4 CCL, the same thickness and the same line width allow the aluminum substrate to carry higher currents.
The insulating layer is the core technology of Aluminum base copper clad laminate, which mainly functions as bonding, insulation and heat conduction. The PCB CCL insulation is the largest thermal barrier in the power module architecture. The better the thermal conductivity of the insulating layer, the more favorable the diffusion of heat generated during the operation of the device, the more favorable it is to reduce the operating temperature of the device, thereby improving the power load of the module, reducing the volume, extending the life, and improving the power output. .
What kind of metal is used for the insulating metal substrate depends on the thermal expansion coefficient, thermal conductivity, strength, hardness, weight, surface state and cost of the metal substrate.
In general, aluminum plates are an ideal choice considering cost and technical performance. There are 6061, 5052, 1060 and so on. Copper, stainless steel, iron and silicon steel sheets can also be used if they have higher thermal conductivity, mechanical properties, electrical properties and other special properties.
ZTELEC offers different specifications of Aluminum base CCL, which can also be customized according to customer needs.