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Epoxy board application characteristics

ZTELEC Insulation Materials | 18-05-9

1, various forms A variety of resins, curing agents, and modifier systems can be adapted to suit the requirements of various applications, ranging from very low viscosity to high melting point solids.
2, easy to cure With a variety of different curing agents, the epoxy resin system can be cured in the temperature range of 0-180°C.
3, strong adhesion The presence of polar hydroxyl groups and ether bonds inherent in the epoxy resin chain gives it high adhesion to various substances. The shrinkage of the epoxy resin when cured is low and the resulting internal stress is small, which also helps to increase the adhesive strength.
Epoxy board application characteristics
4, low shrinkage The reaction of the epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization of epoxy groups in the resin molecules, without the release of water or other volatile by-products. Compared with unsaturated polyester resins and phenolic resins, they show very low shrinkage (less than 2%) during curing.
5, mechanical properties The cured epoxy resin system has excellent mechanical properties.

Ztelec Group