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Four major differences between FR-4 CCL and aluminum CCL

ZTELEC Insulation Materials | 18-08-29

FR-4 CCL and Aluminium CCL are the two mainstream CCLs on the market, but few people can tell the difference.
1, heat dissipation
The heat dissipation of the aluminum substrate is higher than that of the FR-4 copper clad laminate, the heat dissipation of the aluminum substrate and the density of the insulating layer, thermal conductivity, and the thinner the insulating layer, the higher the thermal conductivity.
2, mechanical function
The aluminum substrate has high mechanical strength and resistance compared to a copper clad laminate.

FR-4 CCL,Aluminium CCL

3, electromagnetic shielding function
The aluminum substrate can be used as a shielding plate to shield electromagnetic waves, and the effect is better than that of copper clad laminates.
4, thermal expansion coefficient
Because of the general thermal expansion of the copper cladding, it is easy to affect the quality of the metal holes and wires. The thermal expansion coefficient of the aluminum substrate is smaller than the thermal expansion coefficient of the FR-4 copper clad laminate, which helps to ensure the quality and reliability of the printed circuit board.

ZTELEC offers different low-priced FR-4 CCL and aluminum-based CCL for LED lamps.

Ztelec Group